| Company Name | : | SQ Advanced Interconnect Berhad (Formerly known as Qdos Holdings Bhd ("SQAI") |
| Proposal Type and Board | : | Initial public offering ("IPO") on the Main Market of Bursa Malaysia Securities Berhad "MAIN Market") |
| Principal Adviser(s) | : | UOB Kay Hian (M) Sdn Bhd |
| Principal Activity | : | SQAI is an investment holding company and through its subsidiaries (collectively, "SQAI Group" or the "Group"), the Group is principally involved in the business of manufacturing and assembly of flexible printed circuit board and manufacturing of integrated circuits substrates, covering circuit design, prototype, fabrication and production. |
| Shares to be issued/offered | : | Initial public offering ("IPO") of 337,500,000 ordinary shares in SQAI ("Shares") in conjunction with the listing of and quotation for the entire enlarged issued Shares on the Main Market comprising an offer for sale of 135,000,000 existing Shares ("Offer Shares") and a public issue of 202,500,000 new Shares ("Issue Shares") involving:-
Subject to the clawback and reallocation provisions |
| Date of Exposure | : | 12 March 2026 |
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(pdf - 1.06MB) |
| Corporate Directory | (pdf - 695KB) |
| Introduction | (pdf - 690KB) |
| Prospectus Summary | (pdf - 788KB) |
| Details of Our IPO | (pdf - 942KB) |
| Risk Factors | (pdf - 807KB) |
| Information on Our Group | (pdf - 832KB) |
| Business Overview | (pdf - 2.65MB) |
| Independent Market Research Report | (pdf - 243KB) |
Information on Our Promoters, Substantial Shareholders, Directors and Key Senior Management |
(pdf - 384KB) |
Related Party Transactions |
(pdf - 124KB) |
| Conflict of Interest | (pdf - 42KB) |
| Financial Information | (pdf - 1.98MB) |
| Accountants' Report | (pdf - 839KB) |
Additional Information |
(pdf - 131KB) |
| Procedures for Application | (pdf - 727KB) |
Annexure A: Our Material Trademarks, Brand Names and Other Intellectual Property Rights |
(pdf - 73KB) |
Annexure B: Our Major Certificates, Licenses, Permits and Approvals |
(pdf - 110KB) |
Annexure C: Material Properties |
(pdf - 69KB) |
Annexure D: By-Laws Governing the LTIP |
(pdf 444KB) |