| Company Name | : | SkyeChip Berhad ("SkyeChip") |
| Proposal Type and Board | : | Initial public offering ("IPO") on the Main Market |
| Principal Adviser(s) | : | Maybank Investment Bank Berhad |
| Principal Activity | : | SkyeChip and its subsidiaries (collectively the "Group"), is principally involved in integrated circuit ("IC") design specialising in silicon intellectual property ("IP") and silicon products including custom application-specific integrated circuits ("ASIC"). |
| Shares to be issued/offered | : | IPO of 400,000,000 ordinary shares in SkyeChip ("IPO Shares") in conjunction with the listing of and quotation for the entire enlarged issued ordinary shares in SkyeChip on the Main Market of Bursa Malaysia Securities Berhad comprising a public issue of 400,000,000 new shares involving :
Subject to the clawback and reallocation provisions. The Final Retail Price will be equal to the lower of the Retail Price or the Institutional Price. |
| Date of Exposure | : | 18 November 2025 |
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(pdf - 806KB) |
Corporate Directory |
(pdf - 64KB) |
| Introduction | (pdf - 56KB) |
| Prospectus Summary | (pdf - 934KB) |
| Details of Our IPO | (pdf - 963KB) |
| Risk Factors | (pdf - 170KB) |
| Information on Our Group | (pdf - 873KB) |
| Business Overview | (pdf - 1.99MB) |
| Industry Overview | (pdf - 252KB) |
Information on Our Promoters, Substantial Shareholders, Director and Key Senior Management |
(pdf - 1.35MB) |
| Related Party Transactions | (pdf - 74KB) |
| Conflict of Interest | (pdf - 879KB) |
| Financial Information | (pdf - 1.95MB) |
| Accountants' Report | (pdf - 1.46MB) |
| Additional Information | (pdf - 105KB) |
| Procedures for Application | (pdf - 121KB) |
Annexure A: Our Trademarks, Brand Names And Other Intellectual Property Rights |
(pdf - 53KB) |
Annexure B: By-Laws Governing The LTIP |
(pdf - 850KB) |